SRC Task ID
#425.012
CMOS
Biochip for Rapid Assessment of New Chemicals |
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Hsi-An Kwong |
Freescale Semiconductor Inc. |
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Phil Naughton |
SEMATECH |
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Thomas Roche |
Freescale Semiconductor Inc. |
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Dawn Speranza |
SEMATECH |
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Walter Worth |
SEMATECH |
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SRC Task ID # 425.013
Non-PFOS/Non-PFAS Photoacid
Generators: Environmentally Friendly Candidates
for Next Generation Lithography |
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Jim Jewett |
Intel Corporation |
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Additional Industrial
Interaction:
AZ Microelectronics
Intel Corporation
International SEMATECH
Rohm & Haas Electronic Materials
TOK |
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SRC Task ID #425.014
Environmentally Benign
Electrochemically-Assisted Chemical-Mechanical Planarization |
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Chris Borst |
Albany Nanotech |
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Renhe Jia |
Applied Materials Inc. |
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Raghu Gorantla |
Intel Corporation |
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Zhen Guo |
Intel Corporation |
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Michael Ru |
Intel Corporation |
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Liming Zhang |
Intel Corporation |
Additional Industrial Interaction:
Applied Materials Inc. |
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SRC Task ID #425.015
Reductive Dehalogenation of
Perfluoroalkyl Surfactants in Semiconductor Effluents |
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Walter Worth |
SEMATECH |
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Tim Yeakley |
Texas Instruments Inc. |
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SRC Task ID #425.016
EHS Impact of Electrochemical
Planarization Technologies |
Industrial Interaction:
Cabot Microelectronics Corporation
IBM Corporation
Intel Corporation
Novellus Systems Inc.
Rohm & Haas Microelectronics
Texas Instruments Inc. |
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SRC Task ID #425.017
Environmentally Benign Vapor
Phase and Supercritical CO2 Processes for Patterned
Low k Dielectrics |
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Will Conley |
Freescale/SEMATECH |
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Kim Dean |
SEMATECH |
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Harry Levinson |
Advance Micro Devices Inc. |
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Robert Miller |
IBM Corporation |
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Kevin Orvek |
Intel/SEMATECH |
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Dorel Toma |
Tokyo Electron Ltd. |
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Quingguo Wu |
Tokyo Electron Ltd. |
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Wang Yueh |
Intel Coporation |
Additional Industrial Interaction:
Advanced Microdevices Inc.
BOC
IBM Almaden Research Center
IMEC
Intel Corporation
Rohm & Haas Microelectronics |
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SRC Task ID #425.018
Destruction of Perfluoroalkyl
Surfactants in Semiconductor Process Waters Using
Boron Doped Diamond Film Electrodes |
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Thomas Diamond |
IBM Corporation |
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Jim Jewett |
Intel Corporation |
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Laura Mendicino |
Freescale Semiconductor Inc. |
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Walter Worth |
SEMATECH |
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Tim Yeakley |
Texas Instruments Inc. |
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SRC Task ID #425.019
Low Environmental Impact
Processing of Sub-50 nm Interconnect Structures |
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(None listed) |
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SRC Task ID #425.020
An Integrated, Multi-Scale
Framework for Designing Environmentally Benign Copper, Tantalum and
Ruthenium Planarization Processes |
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Sriram Anjur |
Cabot Microelectronics Corporation |
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Toranosuka Ashizawa |
Hitachi Chemical Co. Ltd. |
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Leonard Borucki |
Araca Inc. |
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Masanobu Habiro |
Hitachi Chemical America |
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Karey Holland |
Neopad Technologies Corporation |
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Sudhanshu Misra |
Neopad Technologies Corporation |
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Mansour Moinpour |
Intel Corporation |
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Hiroyuki Morishima |
Hitachi Chemical Co. Ltd. |
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Ananth Naman |
Cabot Microelectronics Corporation |
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Peter Ojerholm |
Ehwa |
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Abaneshwar Prasad |
Cabot Microelectronics Corporation |
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Naoki Rikita |
Mitsubishi Materials Corporation |
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Cliff Spiro |
Cabot Microelectronics Corporation |
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Christopher Wargo |
Entegris Inc. |
Additional Industrial Interaction:
Cabot Microelectronics
Intel Corporation
JSR Microelectronics |
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SRC Task ID #425.021
Low-Water and Low-Energy Rinsing
and Drying of Patterned Wafers, Nano-Structures,
and New Materials Surfaces |
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Marie Burnham |
Freescale Semiconductor Inc. |
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Seung-Ki Chae |
Samsung Electronics Co. Ltd. |
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Doug Goodman |
Environmental Metrology Corporation |
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Jeong-Nam Han |
Samsung Electronics Co. Ltd. |
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Pil-Kwon Jun |
Samsung Electronics Co. Ltd. |
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Hsi-An Kwong |
Freescale Semiconductor Inc. |
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Thomas Roche |
Freescale Semiconductor Inc. |
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Jack Shively |
Freescale Semiconductor Inc. |
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SRC Task ID #425.022
Environmentally Friendly Cleaning
of New Materials and Structures for Future Micro-
and Nano-Electronics
Manufacturing |
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Zhen Guo |
Intel Corporation |
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Michael Ru |
Intel Corporation |
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Robert Small |
R. S. Associates |
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Liming Zhang |
Intel Corporation |
Additional Industrial Interaction:
SEMATECH
Texas Instruments |
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Customized Project
ESH Assessment: Materials, Structures and Processes for Nano-Scale
MOSFETs with High-Mobility Channel |
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David Brunco |
Intel/IMEC |
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Niti Goel |
Intel/SEMATECH |
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Wilman Tsai |
Intel Corporation |
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Customized Project
Post-Planarization Waste Minimization |
Industrial Interaction:
ITW Rippey Corporation |
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Customized Project
Simulation of Pad Stain Formation during Copper CMP |
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Leonard Borucki |
Araca Inc. |
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Brian Brown |
Novellus Systems Inc. |
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Sooyun Joh |
Novellus Systems Inc. |
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Fergal O'Moore |
Novellus Systems Inc. |
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Customized Project
Effect of Concentric Slanted Groove Patterns on Slurry Flow during Copper
CMP |
Industrial Interaction:
Toho Engineering |
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Customized Project
Biologically Inspired Nano-Manufacturing (BIN-M) |
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Jeremy Klitzke |
SEZ |
Additional Industrial Interaction:
ASM America Inc.
Science Foundation Arizona
Technology Research Initiative Fund (TRIF) |
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Customized Project
Lowering Material and Energy Usage during
Purging Gas Distribution Systems |
Industrial Interaction:
Intel Corporation |
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Customized Project
Electro-Coagulation Applied to Water Conservation and
Wastewater Treatment |
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Allen Boyce |
Intel Corporation |
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Avi Fuerst |
Intel Corporation |
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Zoe Georgousis |
Intel Corporation |
Additional Industrial Interaction:
Arizona Water Institute |
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Customized Project
Impact of Fluoride and Copper in Wastewater on Publicly-Owned Treatment
Works (POTWs) |
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Walter Worth |
SEMATECH |
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Customized Project
Low-Energy Hybrid (LEH) Technology for Water and Wastewater Purification and
Recycling |
Industrial Interaction:
Industrial Technology Research Institute (ITRI): Energy and Resources
Laboratories
Technology Research Initiative Fund (TRIF) |
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Customized Project
A Survey of Water Use, Reuse, and Policies Affecting S/C Industry in
Southwest |
Industrial Interaction:
Technology Research Initiative Fund (TRIF) |
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