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Research Strategy and Organization
 |
Environmental factors are often not included in the design and development
of new tools and processes in the semiconductor industry. Integrating Design
For the Environment into new processes and tools for the
industry is the technical driver and the common theme of the Center’s
research. The Center’s interdisciplinary research efforts involve
14 universities and 11 different academic disciplines.
The semiconductor industry is a very fast-moving industry, one which creates many
opportunities for innovation and implementation of changes. The fast pace also presents a
major challenge in planning and conducting long-term research. One challenge is to strike
the right balance between long-term development, short-term relevance, and application to
the present problems. The Center’s research strategy is to maintain this balance
and promote a mix of projects and activities ranging from high-risk, high-payoff research
to smaller projects with more immediate applications. |
Originally organized in thrusts built around semiconductor manufacturing
processes [Thrust A (Back-End Processes), Thrust
B (Front-End), Thrust C (Factory Integration), and Thrust D
(Patterning)], the Center's current SRC-GRC/SEMATECH core research, customized
projects, and new initiative projects are listed
below.
Annual reports, interim research reports, and annual review meeting materials
are also listed below, available to SRC and ERC members only;
these materials are password
protected, privileged
information and not for distribution. If you have
questions regarding the annual report/review information, contact Karen
McClure at
(kmcclure@erc.arizona.edu). SRC members can also
accessed ERC research information via the SRC website:
http://www.src.org.
SRC/SEMATECH ERC
CORE PROJECTS
2010-2011 |
|
425.023 |
Environmental Safety and Health (ESH) Impacts of Emerging Nanoparticles and
Byproducts from Semiconductor Manufacturing-Preparation and
Characterization of Nanoparticles
Faculty participants: Farhang
Shadman, University of Arizona; Reyes Sierra, University of Arizona; Jim
Field, University of Arizona; Scott Boitano, University of Arizona; Buddy
Ratner, University of Washington |
|
425.024 |
Environmental Safety and Health (ESH) Impacts of Emerging Nanoparticles and
Byproducts from Semiconductor Manufacturing-Toxicity Assessment
and Prediction
Faculty participants:
Farhang Shadman, University
of Arizona; Reyes Sierra, University of Arizona; Jim Field, University of
Arizona; Scott Boitano, University of Arizona; Buddy Ratner, University of
Washington |
|
425.025 |
Development
of Quantitative Structure-Activity Relationship for Prediction of Biological
Effects of Nanoparticles Associated with Semiconductor Industries
Faculty participants:
Yongsheng Chen, Georgia Institute of Technology;
Jonathan Posner, Arizona State University; Trevor Thornton, Arizona State
University |
|
425.026 |
Low-ESH-Impact
Gate Stack Fabrication by Selective Surface Chemistry
Faculty participants: Anthony Muscat,
University of Arizona |
|
425.027 |
Predicting, Testing, and
Neutralizing Nanoparticle Toxicity
Faculty participants:
Steven Nielsen, University of Texas-Dallas; Rockford Draper, University
of Texas-Dallas; Paul Pantano, University of Texas-Dallas; Inga Musselman,
University of Texas -Dallas; Gregg Dieckmann, University of Texas-Dallas;
Ara Philipossian, University of Arizona |
|
425.028 |
Lowering the Environmental Impact
of High-k and Metal Gate-Stack Surface Preparation Processes
Faculty participants: Yoshio
Nishi, Stanford University; Srini Raghavan, University of Arizona; Farhang
Shadman, University of Arizona; Bert Vermeire, Arizona State University |
|
425.029 |
Sugar-Based
Photoacid Generators ("Sweet" PAGs): Environmentally Friendly Materials for
Next Generation Photolithography
Faculty participants:
Christopher Ober, Cornell University; Reyes Sierra, University of Arizona |
|
425.030 & 425.031 |
Supercritical Carbon
Dioxide Compatible Additives: Design, Synthesis, and Application of an
Environmentally Friendly Development Process to Next Generation Lithography-Resists and Additives
Faculty participants:
Juan de Pablo, University of Wisconsin ; Christopher Ober, Cornell
University |
|
425.032 |
Fundamentals
of Advanced Planarization: Pad Micro-Texture, Pad Conditioning, Slurry Flow,
and Retaining Ring Geometry
Faculty participants:
Ara Philipossian, University of Arizona; Duane Boning, Massachusetts
Institute of Technology |
|
425.033 |
Development
of an All-Wet Benign Process Based on Catalyzed Hydrogen Peroxide (CHP)
Chemical System for Stripping of Implanted State-of-the-Art Deep UV Resists
Faculty participants: Srini Raghavan,
University of Arizona |
|
425.034 |
Improvement
of ESH Impact of Back End of Line (BEOL) Cleaning Formulations Using Ionic
Liquids to Replace Traditional Solvents
Faculty participants: Srini
Raghavan, University of Arizona |
|
425.035 |
High-Throughput Cellular-Based Toxicity Assays for
Manufactured Nanoparticles and Nanostructure-Toxicity Relationship Models
Faculty participants:
Alex Tropsha, University of North Carolina-Chapel Hill; Russell Mumper,
University of North Carolina-Chapel Hill |
|
CUSTOMIZED PROGRAM ON HIGH-VOLUME
NANO-MANUFACTURING (HVnM)
(Co-sponsored by Intel and ERC) |
Lowering Slurry Use and Waste in CMP
Processes: Investigation of the Relationship between Planarization & Pad
Surface Micro-Topography
Ara Philipossian, Chemical and Environmental Engineering, University of Arizona |
Lowering Waste in CMP Processes: Retaining
Ring and Conditioner Interactions
Ara Philipossian, Chemical and Environmental Engineering, University of Arizona |
Contamination Control in Gas Distribution
Systems for Semiconductor Fabs
Farhang Shadman, Chemical and Environmental Engineering, University of Arizona |
Develop an AFM-Based Methodology to Optimize
APM Composition for Removing Particles from Surfaces
Srini Raghavan, Material Science and Engineering, University of Arizona |
Integrated Electrochemical Treatment of CMP
Waste Streams for Water Reclaim and Conservation
Jim Baygents and Jim Farrell, Chemical and Environmental Engineering, University of Arizona |
|
NEW INITIATIVE IN ENERGY USE
REDUCTION
(White Papers and Pre-Proposals) |
Electro-Deposition of Semiconducting Silicon
Films
Dominic Gervasio, Chemical and Environmental Engineering, University of
Arizona |
Efficiency Standards for Facilities
Components: Pumps, Chillers, and Fans
David Dornfeld, Mechanical Engineering, University of California-Berkeley |
Metamaterial-Inspired Nanoscale-Engineered
Thermo-Electrics for Efficient Heat Harvesting in Semiconductor Devices
Krishna Muralidharan, Material Science and Engineering, University of
Arizona |
Low-Energy Amorphous Silicon Processing:
Femtosecond-Processed Hydrogenated Amorphous Silicon
Charles Falco, Optical-Sciences/Physics, University of Arizona |
Thermo-Economic Analysis of Selected Wet
Cleaning Processes
Manish Keswani, Material Science and Engineering, University of Arizona |
Improved Energy Efficiency in Buildings
Steven Leeb, Electrical Engineering, MIT |
|
SRC/SEMATECH ERC INTERIM REPORTS
CORE FUNDING [CURRENT] |
425.023
Environmental Safety and Health (ESH) Impacts of Emerging
Nanoparticles and Byproducts from Semiconductor Manufacturing-Preparation
and Characterization of Nanoparticles
[Oct.2009:
P054145] [Dec.2009:
P054974] [Feb.2010:
(1)
P055562; (2)
P054902] [Dec.2010:
P058873]
[Feb.2011: TBP] [May
2011: TBP] [Dec.2011: TBP]
[Mar.2012: (1) (2) TBP]
425.024
Environmental Safety and Health (ESH) Impacts of Emerging Nanoparticles and
Byproducts from Semiconductor Manufacturing-Toxicity Assessment
[Dec.2009:
P054904] [Feb.2010:
P054902] [Dec.2010: (1)
P058868;
(2)
P058869] [Feb.2011:
TBP] [Jun.2011: TBP] [Dec.2011:
(1) (2): TBP] [Mar.2012: (1) (2)
(3) (4) TBP]
425.025
Development of Quantitative Structure-Activity Relationship for Prediction
of Biological Effects of Nanoparticles Associated with Semiconductor
Industries
[Dec.2009:
P054620] [Feb.2010:
P054674] [Dec.2010:
P058848]
[Feb.2011: TBP]
Dec.2011: TBP] [Mar.2012:
TBP]
425.026 Low-ESH-Impact
Gate Stack Fabrication by Selective Surface Chemistry
[Sep.2009:
P053678] [Feb.2010:
P054862] [Sep.2010:
P057909]
[Feb.2011: TBP] [Sep.2011:
TBP] [Mar.2012: TBP]
425.027 Predicting,
Testing, and Neutralizing Nanoparticle Toxicity
[Feb.2010:
P054863] [Mar.2010:
P055331] [Feb.2011: TBP]
[Mar.2011: TBP] [Mar.2012:
(1) (2) TBP]
425.028 Lowering the Environmental Impact of
High-k and Metal Gate-Stack Surface Preparation Processes
[Sep.2009:
P053838] [Jan.2010:
P055359] [Feb.2010:
P054864] [Mar.2010:
P056002] [Apr.2010:
P055857]
[Sep.2010:
P057835] [Jan.2011:
TBP] [Feb.2011 (1) (2): TBP]
[Mar.2011: TBP] [Jan.2012
(1) (2): TBP] [Mar.2012: TBP]
425.029 Sugar-Based Photoacid Generators
("Sweet" PAGs): Environmentally Friendly Materials for Next Generation
Photolithography
[Dec.2009:
P054907] [Feb.2010:
TBP] [Jun.2010:
P057001] [Dec.2010
(1) (2) (3): TBP] [Feb.2011: TBP]
[Jun.2011 (1) (2): TBP] [Dec.2011
(1) (2): TBP] [Mar.2012: TBP]
425.030 Supercritical Carbon Dioxide
Compatible Additives: Design, Synthesis, and Application of an
Environmentally Friendly Development Process to Next Generation Lithography:
Resists and Additives
[Jun.2009: [P052679] [Dec.2009:
P054936] [Feb.2010:
P054927]
[Jun.2010:
P056696] [
Dec.2010:
P058841] [Feb.2011:
TBP] [Jun.2011: TBP] [Mar.2012
(1) (2): TBP]
425.031 Supercritical Carbon Dioxide
Compatible Additives: Design, Synthesis, and Application of an
Environmentally Friendly Development Process to Next Generation Lithography:
Resists and Additives
[Jun.2009: (1&2)
P053360] [Dec.2009:
P055059] [Feb.2010:
P054928]
[Dec.2010: TBP] [Feb.2011:
TBP] [Jun.2011: TBP] [Dec.2011:
TBP] [Mar.2012: TBP]
425.032 Fundamentals of Advanced
Planarization: Pad Micro-Texture, Pad Conditioning, Slurry Flow, and
Retaining Ring Geometry
[Oct.2009:
P054108] [Dec.2009:
P054519] [Feb.2010:
P054869]
[Apr.2010:
P055814] [Oct.2010:
(1)
P058210 (2)
P058801] [Feb.2011:
TBP] [Apr.2011: TBP] [Oct.2011:
TBP] [Dec.2011: TBP] [Jan.2012:
TBP]
425.033 Development of an All-Wet Benign
Process Based on Catalyzed Hydrogen Peroxide (CHP) Chemical System for
Stripping of Implanted State-of-the-Art Deep UV Resists
[Jun.2009:
P054136] [Jan.2010:
P055389] [Feb.2010:
P054870]
[Aug.2010:
P057443] [Dec.2010:
P058906] [Feb.2011: TBP]
[Aug.2011: TBP] [Feb.2012:
TBP] [Mar.2012: TBP]
425.034 Improvement of ESH Impact of Back End
of Line (BEOL) Cleaning Formulations Using Ionic Liquids to Replace
Traditional Solvents
[Oct.2009:
P054321]
[Feb.2010:
P054871]
[Sep.2010:
P058011]
[Feb.2011:
TBP] [Aug.2011:
TBP] [Feb.2012:
TBP] [Mar.2012: TBP]
425.035 High-Throughput Cellular-Based
Toxicity Assays for Manufactured Nanoparticles and Nanostructure-Toxicity
Relationships Models
[Feb.2010:
P054872] [Mar.2010:
(1)
P055576 (2)
P055674 (3)
P055675 (4)
P055577 (5)
P055578 (6)
P055579 (7)
P055580] [Feb.2011: TBP]
[Mar.2011 (1) (2) (3) (4) (5): TBP ] [Mar.2012
(1) (2) (3) (4) (5) (6): TBP]
|
|
INTERIM REPORTS
CORE
FUNDING [2007-2008] |
425.012: CMOS
Biochip for Rapid Assessment of New Chemicals [2007:
March
1]
425.013: Non-PFOS/Non-PFAS Photoacid Generators:
Environmentally Friendly Candidates for Next Generation Lithography
[2008:
May
1] [2007: Dec.1]
[2009: Feb.1]
425.014: Environmentally Benign
Electrochemically Assisted Chemical Mechanical Planarization (E-CMP) [2008:
March
1; Sept.2] [2007:
Dec.1]
425.015: Reductive Dehalogenation of Perfluoroalkyl Surfactants in Semiconductor
Effluents [2008:
June
1; June
2) [2007:
June
1; June
2]
425.016: EHS Impact of Electrochemical Planarization
Technologies [2008: June
1] [2007: Sept.1; Dec.2]
425.017:
Environmentally Benign Vapor Phase and Supercritical CO(2) Processes for
Patterned Low k Dielectrics [2008:
March
1; March
2; March
3] [2007:
March
1; March
2; March
3]
425.018:
Destruction of Perfluoroalkyl Surfactants in Semiconductor Process
Waters using Boron Doped Diamond Film Electrodes [2008:
June
1; June
2; June
3] [2007:
June
1;
June
2; June
3; Dec.4]
425.019: Low Environmental Impact Processing of sub-50
nm Interconnect Structures [2008:
May
1] [2007:
Feb.1;
March
2]
425.020: An Integrated, Multi-Scale Framework for
Designing Environmentally-Benign Copper, Tantalum and Ruthenium
Planarization Processes [2008:
March
1, Aug.
2, Sept.
3] [2007:
Aug.
1]
425.021: Low-Water and Low-Energy Rinsing and
Drying of Patterned Wafers, Nano-Structures, and New Materials Surfaces [2008:
June
1] [2007:
June
1, Dec.
2]
425.022: Environmentally-Friendly Cleaning of
New Materials and Structures for Future Micro- and Nano-Electronics
Manufacturing [2008:
March
1, March
2, Sept.
3] [2007:
March
1] |
|
ANNUAL REVIEW PRESENTATIONS
|
2010-Feb.18th
2010-Feb.19th
2009;
2008;
2007;
2006
|
2005; 2004; 2003; 2002; 2001;
2000
(contact Karen McClure) |
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