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Research Strategy and Organization
 |
Environmental factors are often not included in the design and development
of new tools and processes in the semiconductor industry. Integrating Design
For the Environment into new processes and tools for the
industry is the technical driver and the common theme of the Center’s
research. The Center’s interdisciplinary research efforts involve
14 universities and 11 different academic disciplines.
The semiconductor industry is a very fast-moving industry, one which creates many
opportunities for innovation and implementation of changes. The fast pace also presents a
major challenge in planning and conducting long-term research. One challenge is to strike
the right balance between long-term development, short-term relevance, and application to
the present problems. The Center’s research strategy is to maintain this balance
and promote a mix of projects and activities ranging from high-risk, high-payoff research
to smaller projects with more immediate applications. |
Originally organized in thrusts built around
semiconductor manufacturing processes: Thrust A (Back-End Processes), Thrust
B (Front-End), Thrust C (Factory Integration), and Thrust D
(Patterning), the Center's current SRC/SEMATECH core research projects, as well
as non-core projects, are listed
below.
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CURRENT CORE ERC PROJECTS |
|
425.023 |
Environmental Safety and Health (ESH) Impacts of Emerging Nanoparticles and
Byproducts from Semiconductor Manufacturing --
Preparation and
Characterization of Nanoparticles
Faculty participants: Farhang
Shadman, University of Arizona; Reyes Sierra, University of Arizona; Jim
Field, University of Arizona; Scott Boitano, University of Arizona; Buddy
Ratner, University of Washington |
|
425.024 |
Environmental Safety and Health (ESH) Impacts of Emerging Nanoparticles and
Byproducts from Semiconductor Manufacturing --
Toxicity Assessment
and Prediction
Faculty participants:
Farhang Shadman, University
of Arizona; Reyes Sierra, University of Arizona; Jim Field, University of
Arizona; Scott Boitano, University of Arizona; Buddy Ratner, University of
Washington |
|
425.025 |
Development
of Quantitative Structure-Activity Relationship for Prediction of Biological
Effects of Nanoparticles Associated with Semiconductor Industries
Faculty participants:
Yongsheng Chen, Arizona State University/Georgia Institute of Technology;
Jonathan Posner, Arizona State University; Trevor Thornton, Arizona State
University |
|
425.026 |
Low-ESH-impact
Gate Stack Fabrication by Selective Surface Chemistry
Faculty participants: Anthony Muscat,
University of Arizona |
|
425.027 |
Predicting, Testing, and
Neutralizing Nanoparticle Toxicity
Faculty participants:
Steven Nielsen, University of Texas-Dallas; Rockford Draper, University
of Texas-Dallas; Paul Pantano, University of Texas-Dallas; Inga Musselman,
University of Texas -Dallas; Gregg Dieckmann, University of Texas-Dallas;
Ara Philipossian, University of Arizona |
|
425.028 |
Lowering the Environmental Impact
of High-k and Metal Gate-Stack Surface Preparation Processes
Faculty participants: Yoshio
Nishi, Stanford University; Srini Raghavan, University of Arizona; Farhang
Shadman, University of Arizona; Bert Vermeire, Arizona State University |
|
425.029 |
Sugar-Based
Photoacid Generators (Sweet PAGs): Environmentally Friendly Materials for
Next Generation Photolithography
Faculty participants:
Christopher Ober, Cornell University; Reyes Sierra, University of Arizona |
|
425.030 & 425.031 |
Carbon
Dioxide Compatible Additives: Design, Synthesis, and Application of an
Environmentally Friendly Development Process to Next Generation Lithography
-- Resists and Additives
Faculty participants:
Juan de Pablo, University of Wisconsin ; Christopher Ober, Cornell
University; James Watkins, University of Massachusetts |
|
425.032 |
Fundamentals
of Advanced Planarization: Pad Micro-Texture, Pad Conditioning, Slurry Flow,
and Retaining Ring Geometry
Faculty participants:
Ara Philipossian, University of Arizona; Duane Boning, Massachusetts
Institute of Technology |
|
425.033 |
High-dose
Implant Resist Stripping (HDIS): Alternatives to ASH/Strip Method
Faculty participants: Srini Raghavan,
University of Arizona |
|
425.034 |
Improvement
of ESH Impact of Back End of Line (BEOL) Cleaning Formulations Using Ionic
Liquids to Replace Traditional Solvents
Faculty participants: Srini
Raghavan, University of Arizona |
|
425.035 |
Computational Models and High-Throughput Cellular-Based Toxicity Assays for
Predictive Nanotoxicology
Faculty participants:
Alex Tropsha, University of North Carolina-Chapel Hill; Russell Mumper,
University of North Carolina-Chapel Hill; Denis Fourches, University of
North Carolina-Chapel Hill |
|
|
NO COST EXTENSION: |
|
Non-PFOS/Non-PFAS Photoacid
Generators: Environmentally Friendly Candidates for Next Generation
Lithography (425.012: Ober, Cornell
University) |
|
Novel Methods for Destruction of PFOS in
Semiconductor Process Waters Using Boron-Doped Diamond Film Electrodes
(425.018: Farrell & Sierra,
University of Arizona) |
|
Low Environmental-Impact Processing of sub-50 nm Interconnect Structures
(425.017: Watkins, University of
Massachusetts) |
|
Environmentally Benign Electrochemically Assisted Chemical Mechanical
Planarization (425.016: West,
Columbia University; Raghavan, University of Arizona) |
|
CUSTOMIZED ERC
RESEARCH PROJECTS |
Nano-Manufacturing of S/C Devices by
Biologically-Inspired Processes
A.Muscat, M.McEvoy, M.Mansuripur, University of Arizona (Co-sponsored by
Science Foundation Arizona, ASM, SEZ, Arizona TRIF Initiative) |
Electro-Coagulation Applied to Water
Conservation & Wastewater Treatment
J.Baygents, J.Farrell, University of Arizona (Co-sponsored by WSP and
Intel) |
Effect of Polisher Kinematics in Reducing
Average Shear Force and Increasing Removal Rate in Copper CMP
A Philipossian, University of Arizona; D.Boning, Massachusetts Institute
of Technology (Sponsored by Hitachi Chemical) |
Impact of Fluoride and Copper in Wastewater
on Publicly-Owned Treatment Works
R.Sierra, University of Arizona (Sponsored by Sematech) |
A Survey of Water Use, Reuse, and Policies
Affecting Semiconductor Industry in Semi-Arid Areas
S.Megdal, WRRC-University of Arizona (Sponsored by Arizona TRIF
Initiative) |
Reducing Water and Chemical Usage in Large
Wafer (450mm) Single-Wafer Processing Tools
B.Vermeire, Arizona State University (Sponsored by EMC) |
EHS Assessment of Chelators and Biocides
Utilized in Semiconductor Manufacturing
R.Sierra, University of Arizona (Sponsored by Sematech) |
Low-Energy-Hybrid Technology for
Ultra-Purification and Recycling of Water
F.Shadman, University of Arizona (Sponsored by ERC, Pall Corp, and
Arizona TRIF Initiative) |
Fate of CMP Nano-Particles in Typical
Wastewater Treatment Systems
R.Sierra, University of Arizona (Suggested by ISMI; jointly planned and
initiated by ISMI/ERC) |
|
|
CUSTOMIZED PROGRAM ON HIGH-VOLUME
NANO-MANUFACTURING (HVnM)
(Initiated and currently sponsored by Intel) |
Lowering Slurry Use and Waste in CMP
Processes: Investigation of the Relationship between Planarization & Pad
Surface Micro-Topography
A. Philipossian, University of Arizona |
Lowering Waste in CMP Processes: Retaining
Ring and Conditioner Interactions
A. Philipossian, University of Arizona |
Contamination Control in Gas Distribution
Systems for Semiconductor Fabs
F. Shadman, University of Arizona |
Develop an AFM-Based Methodology to Optimize
APM Composition for Removing Particles from Surfaces
S.Raghavan, University of Arizona |
Integrated Electrochemical Treatment of CMP
Waste Streams for Water Reclaim and Conservation
J.Baygents, J.Farrell, University of Arizona |
|
ERC ANNUAL
REPORTS |
(Pages #s listed in directories are
PDF-assigned page #s)
Reports and review
presentations & posters are password
protected, privileged
information for members only and are not for distribution. If you
questions regarding the annual report/review information, contact Karen
McClure at
(kmcclure@erc.arizona.edu). ERC research information can also be
accessed via the SRC website
http://www.src.org; available to SRC members only.
|
Directory
2009; Report
2009
Directory
2008; Report
2008
Directory
2007;
Report
2007
Directory
2006;
Report
2006
Directory
2005; Report
2005 |
Directory
2004;
Report
2004
Directory
2003;
Report
2003
Directory
2002;
Report
2002
Directory
2001;
Report
2001
Directory
2000;
Report
2000 |
|
ERC INTERIM REPORTS - CORE FUNDING - CURRENT |
(Titles listed above)
425.023:
425.024:
425.025:
425.026:
425.027:
425.028:
425.029:
425.030:
425.031:
425.032:
425.033:
425.034:
425.035: |
|
ERC INTERIM REPORTS - CORE
FUNDING - 2007-2008 |
425.012: CMOS
Biochip for Rapid Assessment of New Chemicals [2007:
March
1]
425.013: Non-PFOS/Non-PFAS Photoacid Generators:
Environmentally Friendly Candidates for Next Generation Lithography
[2008:
May
1] [2007: Dec.1]
[2009: Feb.1]
425.014: Environmentally Benign
Electrochemically Assisted Chemical Mechanical Planarization (E-CMP) [2008:
March
1; Sept.2] [2007:
Dec.1]
425.015: Reductive Dehalogenation of Perfluoroalkyl Surfactants in Semiconductor
Effluents [2008:
June
1; June
2) [2007:
June
1; June
2]
425.016: EHS Impact of Electrochemical Planarization
Technologies [2008: June
1] [2007: Sept.1; Dec.2]
425.017:
Environmentally Benign Vapor Phase and Supercritical CO(2) Processes for
Patterned Low k Dielectrics [2008:
March
1; March
2; March
3] [2007:
March
1; March
2; March
3]
425.018:
Destruction of Perfluoroalkyl Surfactants in Semiconductor Process
Waters using Boron Doped Diamond Film Electrodes [2008:
June
1; June
2; June
3] [2007:
June
1;
June
2; June
3; Dec.4]
425.019: Low Environmental Impact Processing of sub-50
nm Interconnect Structures [2008:
May
1] [2007:
Feb.1;
March
2]
425.020: An Integrated, Multi-Scale Framework for
Designing Environmentally-Benign Copper, Tantalum and Ruthenium
Planarization Processes [2008:
March
1, Aug.
2, Sept.
3] [2007:
Aug.
1]
425.021: Low-Water and Low-Energy Rinsing and
Drying of Patterned Wafers, Nano-Structures, and New Materials Surfaces [2008:
June
1] [2007:
June
1, Dec.
2]
425.022: Environmentally-Friendly Cleaning of
New Materials and Structures for Future Micro- and Nano-Electronics
Manufacturing [2008:
March
1, March
2, Sept.
3] [2007:
March
1] |
|
ANNUAL ERC REVIEW PRESENTATIONS
|
|
2009;
2008;
2007;
2006; 2005
|
2004; 2003; 2002; 2001;
2000 |
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