SRC/SEMATECH Engineering Research Center for Environmentally Benign Semiconductor Manufacturing

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Home : Research
ERC Research:


Research Strategy and Organization:

lab1.jpg (84847 bytes) Environmental factors are often not included in the design and development of new tools and processes in the semiconductor industry. Integrating Design For the Environment into new processes and tools for the industry is the technical driver and the common theme of the Center’s research.  The Center’s interdisciplinary research efforts involve eight universities and eleven different academic disciplines.

The semiconductor industry is a very fast-moving industry, one which creates many opportunities for innovation and implementation of changes. The fast pace also presents a major challenge in planning and conducting long-term research. One challenge is to strike the right balance between long-term development, short-term relevance, and application to the present problems. The Center’s research strategy is to maintain this balance and promote a mix of projects and activities ranging from high-risk, high-payoff research to smaller projects with more immediate applications.

Originally organized in Thrusts built around semiconductor manufacturing processes: Thrust A (Back-End Processes), Thrust B (Front-End), Thrust C (Factory Integration), and Thrust D (Patterning), the Center's current SRC/SEMATECH research projects are listed below.


425.012 CMOS Biochip for Rapid Assessment of New Chemicals
425.013 Non-PFOS / Non-PFAS Photoacid Generators: Environmentally Friendly Candidates for Next Generation Lithography
425.014 Environmentally Benign Electrochemically-Assisted Chemical Mechanical Planarization (E-CMP)
425.015 Reductive Dehalogenation of Perfluoroalkyl Surfactants in Semiconductor Effluents
425.016 EHS Impact of Electrochemical Planarization Technologies
425.017 Environmentally Benign Vapor Phase and Supercritical CO2 Processes for Patterned Low k Dielectrics
425.018 Destruction of Perfluoroalkyl Surfactants in Semiconductor Process Waters Using Boron Doped Diamond Film Electrodes
425.019 Low Environmental Impact Processing of Sub-50 nm Interconnect Structures
425.020 An Integrated, Multi-Scale Framework for Designing Environmentally Benign Copper, Tantalum and Ruthenium Planarization Processes
425.021 Low-Water and Low-Energy Rinsing and Drying of Patterned Wafers, Nano-Structures, and New Materials Surfaces
425.022 Environmentally Friendly Cleaning of New Materials and Structures for Future Micro- and Nan-Electronics Manufacturing
Additional Ongoing Research Projects: 



 
PFOS Removal from Wastewater
CMP Delamination Reduction
Post-CMP Cleaning Optimization
Supercritical CO2 Fundamentals
CMP Waste Treatment Survey
Non-Damaging Plasma Etch
Cleaning, Rinsing, and Drying Processes for 45 nm Node
Pore Scaling and Repair of Low-k Films

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Updates in progress
Thrust A  Back-End Processes
Thrust B  Front-End Processes
Thrust C  Factory Integration
Thrust D  Patterning