The Iodine and Methanol Passivation
ESH Impact of Wafer Cleaning
Our Strategic Plan
PPT Slide
LEED
Photoelectron Spectra Temperature Dependence
Methoxy Termination Of Silicon During HF last Clean
Electrical Stability: MOS Device Characterization
Surface Termination Post Wafer Cleaning
LOCOS MOS Process Flow
Current Status of Methoxy Project
Electrical Reliability Measurements
Ambient Stability: Susceptibility to Copper Deposition
Copper Surface Analysis Status
Preliminary Copper Spike Results
Conclusions
Future Copper Work
Gas-Phase Halogens as a Route to Better Surface Passivation
H-Si(111) + Cl2(g) + hu
Photoelectron Spectra Monomethoxy-Termination of Si(111)
Monomethoxy-terminate Si(111)
Conclusion
Future Work
Email: rmo@leland.stanford.edu