Driving Moore�s Law
Historically
- 90% Dimensional Improvements, 10% Material Changes
- Dimensional: Lithography and Etch
- Materials: PSG-BPSG, PVD - CVD W, WSix-TiSi-CoSi
Now
- 50% Dimensional Improvements, 50% Material Changes
- Dimensional: Lithography, Etch, Integration (T-Gate, Damascene)
- Materials: TaO, BST, Low K Dielectric, Copper
Future Beyond 0.1um - Trend Will Continue
- 30% Dimensional Improvements, 70% Material Changes
More Emphasis on Performance due to Materials,
in addition to the traditional Focus on Lithography