PPT Slide

� High thermal conductivity critical

for heat dissipation

� FSG provides equivalent thermal properties to conventional oxides

� ɯx thermal conductivity of Low k

spin-on dielectrics

mW/cm�C

� High hardness critical for electromigration resistance, mechanical stability during CMP

� FSG provides equivalent hardness to

conventional oxides

� ᡌx hardness of Low k SODs

Hardness (GPa)

Thermal Conductivity

Hardness

Bulk Film Comparison vs. HSQ

Oxide-Like Bulk Film Properties Contribute to Integration Ease, Device Reliability

ULTIMA HDP-CVD� FSG